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Vertical heating curing furnace for semiconductor, SMT, dispensing and glue filling industries. 3D heating space design saves energy and space, with efficiency equivalent to a 20-35m tunnel furnace.
This equipment is a vertical heating curing furnace developed for semiconductor, SMT, dispensing and glue filling industries. It changes the plane heating space into a three-dimensional heating space, and has the advantages of saving energy consumption and space.
Perfect alternative to tunnel furnace, the efficiency of this equipment is equivalent to 20-35m tunnel furnace. The equipment adopts embedded system, which is different from ordinary touch screen and industrial computer, it is not only stable and reliable but also has richer and more convenient communication interfaces.
Energy & Space Saving
Tunnel Furnace Equivalent
Heating & Cooling
Compact Curing System
Advanced structural design for optimal performance.
Innovative top push plate design with entrance, rising, falling and exit cycle for efficient product handling.
Controlled by servo motor through encoder, with high position & speed control accuracy. Strong overload capacity for high load and dynamic response.
High-temperature optical fiber moves accurately, avoiding PCB from jamming and dropping caused by motor step loss and mechanical cumulative errors.
The transporting slot can directly clamp the support bar, which can only move in the slot. Therefore the chain doesn't get tangled and runs more stable. It is one of our patents.
The bevel gear width adjustment is more synchronized than traditional chain width adjustment, with better parallelism, which prevents PCB from dropping.
Advanced thermal curing technology for superior results.
Changes plane heating space into three-dimensional heating space, saving energy and space.
Efficiency equivalent to 20-35m tunnel furnace in a compact vertical design.
Different from ordinary touch screen, more stable with richer communication interfaces.
Real dual temperature zone design for both heating and cooling in one system.
Transportation chain driven by servo motor with thermal expansion compensation.
Supports formulation function of key welding parameters and MES remote data reading.
Level + up and down air handling effectively prevents inadequate air handling.
Level 3 protection effectively prevents product damage due to over temperature.
Equipment is designed to be dust-free and can be applied to any dust-free place.
Intelligent PID fuzzy operation provides stronger thermal compensation and lower energy consumption.
Complete technical specifications for all model variants.
Complete technical specifications, dimensions, application notes and installation guidelines.
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